LS Q976 - Osram · Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7) I F = 20 mA...

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LS Q976 1 Version 1.5 | 2020-02-11 www.osram-os.com Applications LS Q976 CHIPLED ® 0603 Electronic Equipment Gaming, Amusement, Gambling White Goods Features: Package: SMT package 0603, colorless diffused resin Chip technology: InGaAlP Typ. Radiation: 150° Color: λ dom = 633 nm ( super red) Optical efficacy: 7 lm/W Corrosion Robustness Class: 3B ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)
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Transcript of LS Q976 - Osram · Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7) I F = 20 mA...

  • LS Q976

    1 Version 1.5 | 2020-02-11

    Produktdatenblatt | Version 1.1 www.osram-os.com

    Applications

    LS Q976

    CHIPLED® 0603

    — Electronic Equipment

    — Gaming, Amusement, Gambling

    — White Goods

    Features: — Package: SMT package 0603, colorless diffused resin

    — Chip technology: InGaAlP

    — Typ. Radiation: 150°

    — Color: λdom = 633 nm (● super red)

    — Optical efficacy: 7 lm/W

    — Corrosion Robustness Class: 3B

    — ESD: 2 kV acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

  • LS Q976

    2 Version 1.5 | 2020-02-11

    Ordering Information Type Luminous Intensity 1) Ordering Code

    IF = 20 mAIv

    LS Q976-NR-1 28 ... 180 mcd Q62702P5187

  • LS Q976

    3 Version 1.5 | 2020-02-11

    Maximum RatingsParameter Symbol Values

    Operating Temperature Top min. max.

    -30 °C85 °C

    Storage Temperature Tstg min. max.

    -40 °C85 °C

    Junction Temperature Tj max. 95 °C

    Forward current TA = 25 °C

    IF max. 25 mA

    Surge Current t ≤ 10 µs; D = 0.1 ; TA = 25 °C

    IFS max. 100 mA

    Reverse voltage 2) TA = 25 °C

    VR max. 12 V

    ESD withstand voltage acc. to ANSI/ESDA/JEDEC JS-001 (HBM, Class 2)

    VESD 2 kV

  • LS Q976

    4 Version 1.5 | 2020-02-11

    CharacteristicsIF = 20 mA; TA = 25 °C

    Parameter Symbol Values

    Peak Wavelength λpeak typ. 645 nm

    Dominant Wavelength 3) λdom min. typ. max.

    627 nm633 nm639 nm

    Spectral Bandwidth at 50% Irel,max ∆λ typ. 16 nm

    Viewing angle at 50% IV 2φ typ. 160 °

    Forward Voltage 4) IF = 20 mA

    VF typ. max.

    2.00 V2.50 V

    Reverse current 2) VR = 12 V

    IR typ. max.

    0.01 µA10 µA

    Temperature Coefficient of Peak Wavelength TCλpeak typ. 0.14 nm / K

    Temperature Coefficient of Dominant Wavelength TCλdom typ. 0.05 nm / K

    Temperature Coefficient of Forward Voltage TCVF typ. -2 mV / K

    Real thermal resistance junction/ambient 5)6) RthJA real max. 900 K / W

    Real thermal resistance junction/solderpoint 5) RthJS real max. 510 K / W

  • LS Q976

    5 Version 1.5 | 2020-02-11

    Brightness Groups Group Luminous Intensity 1) Luminous Intensity. 1) Luminous Flux 7)

    IF = 20 mA IF = 20 mA IF = 20 mAmin. max. typ.Iv Iv ΦV

    N 28 mcd 45 mcd 120 mlm

    P 45 mcd 71 mcd 190 mlm

    Q 71 mcd 112 mcd 290 mlm

    R 112 mcd 180 mcd 470 mlm

    Group Name on Label Example: N-1Brightness Wavelength

    N 1

  • LS Q976

    6 Version 1.5 | 2020-02-11

    Relative Spectral Emission 7)Irel = f (λ); IF = 20 mA; TA = 25 °C

    OHL00555

    4000

    20

    40

    60

    80

    100

    %Ι rel

    λnm450 500 550 600 650 700

    Vλ yellow

    super-redorange

    Radiation Characteristics 7)Irel = f (ϕ); TA = 25 °C

    0

    0.2

    0.4

    1.0

    0.8

    0.6

    ϕ

    1.0 0.8 0.6 0.4

    0˚10˚20˚40˚ 30˚ OHL00408

    50˚

    60˚

    70˚

    80˚

    90˚

    100˚0˚ 20˚ 40˚ 60˚ 80˚ 100˚ 120˚

  • LS Q976

    7 Version 1.5 | 2020-02-11

    Forward current 7)IF = f(VF); TA = 25 °C

    OHL00232

    10 -11.4 1.8 2.2 2.6 3 V 3.4

    010

    110

    10 2

    5

    5

    mA5

    1

    FV

    FI

    Relative Luminous Intensity 7), 8)Iv/Iv(20 mA) = f(IF); TA = 25 °C

    V

    V (20 mA)

    10 -1 010 10 1 210mA10 -3

    5

    OHL00556

    FI

    5

    -210

    5

    -110

    010

    110

    II

    5 5

    yellow,

    super-red

    orange

    Relative Luminous Intensity 7)Iv/Iv(25 °C) = f(Tj); IF = 20 mA

    OHL02378

    0-20 0

    0.4

    0.8

    20 40 60

    1.2

    (25 ˚C)

    V

    V

    I

    1.6

    2.0

    100

    j

    ˚CT

    orangeyellowsuper-red

    super-redyellow

    orange

    I

  • LS Q976

    8 Version 1.5 | 2020-02-11

    Max. Permissible Forward CurrentIF = f(T)

    T

    OHL00873

    0

    FI

    0 20 40 60 80 ˚C 100

    mA

    5

    10

    15

    20

    25

    30

    temp. solder pointtemp. ambientT

    TSA

    TA

    TS

    Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TA = 25 °C

    OHL02140

    10-5

    pt

    FI

    10-4 10-3 10-2 10-1 100 1010

    A

    210s

    DtPT=

    T

    PtIF

    0.01

    0.05

    0.20.1

    0.005

    0.02

    0.5

    D =

    1

    0.02

    0.04

    0.06

    0.08

    0.12

    Permissible Pulse Handling CapabilityIF = f(tp); D: Duty cycle; TA = 85 °C

    OHL02147

    10-5

    pt

    FI

    10-4 10-3 10-2 10-1 100 1010

    A

    210s

    DtPT=

    T

    PtIF

    0.01

    0.05

    0.20.1

    0.005

    0.02

    0.5

    D =

    1

    0.02

    0.04

    0.06

    0.08

    0.12

  • LS Q976

    9 Version 1.5 | 2020-02-11

    Dimensional Drawing 9)

    Further Information:

    Approximate Weight: 1.4 mg

    Corrosion test: Class: 3B Test condition: 40°C / 90 % RH / 15 ppm H2S / 14 days (stricter than IEC 60068-2-43)

  • LS Q976

    10 Version 1.5 | 2020-02-11

    Recommended Solder Pad 9)

    0.8 (0.031)

    0.7 (0.028)

    OHAPY606

    0.8

    (0.0

    31)

    0.8 (0.031)

    For superior solder joint connectivity results we recommend soldering under standard nitrogen atmosphere. Package not suitable for ultra sonic cleaning.

  • LS Q976

    11 Version 1.5 | 2020-02-11

    Reflow Soldering ProfileProduct complies to MSL Level 2 acc. to JEDEC J-STD-020E

    00

    s

    OHA04525

    50

    100

    150

    200

    250

    300

    50 100 150 200 250 300t

    T

    ˚C

    St

    t

    Pt

    Tp240 ˚C

    217 ˚C

    245 ˚C

    25 ˚C

    L

    Profile Feature Symbol Pb-Free (SnAgCu) Assembly UnitMinimum Recommendation Maximum

    Ramp-up rate to preheat*)25 °C to 150 °C

    2 3 K/s

    Time tSTSmin to TSmax

    tS 60 100 120 s

    Ramp-up rate to peak*)TSmax to TP

    2 3 K/s

    Liquidus temperature TL 217 °C

    Time above liquidus temperature tL 80 100 s

    Peak temperature TP 245 260 °C

    Time within 5 °C of the specified peaktemperature TP - 5 K

    tP 10 20 30 s

    Ramp-down rate*TP to 100 °C

    3 6 K/s

    Time25 °C to TP

    480 s

    All temperatures refer to the center of the package, measured on the top of the component* slope calculation DT/Dt: Dt max. 5 s; fulfillment for the whole T-range

  • LS Q976

    12 Version 1.5 | 2020-02-11

    Taping 9)

  • LS Q976

    13 Version 1.5 | 2020-02-11

    Tape and Reel 10)

    Reel DimensionsA W Nmin W1 W2 max Pieces per PU

    180 mm 8 + 0.3 / - 0.1 mm 60 mm 8.4 + 2 mm 14.4 mm 4000

  • LS Q976

    14 Version 1.5 | 2020-02-11

    Barcode-Product-Label (BPL)

    Dry Packing Process and Materials 9)

    OHA00539

    OSRA

    M

    Moisture-sensitive label or print

    Barcode label

    Desiccant

    Humidity indicator

    Barcode label

    OSRAM

    Please check the HIC immidiately afterbag opening.

    Discard if circles overrun.Avoid metal contact.

    WET

    Do not eat.

    Comparatorcheck dot

    parts still adequately dry.

    examine units, if necessary

    examine units, if necessary

    5%

    15%

    10%bake units

    bake units

    If wet,

    change desiccant

    If wet,

    Humidity IndicatorMIL-I-8835

    If wet,

    Moi

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    a) H

    umid

    ity In

    dica

    tor C

    ard

    is >

    10%

    whe

    n re

    ad a

    t 23

    ˚C ±

    5 ˚C

    , or

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    Moisture-sensitive product is packed in a dry bag containing desiccant and a humidity card according JEDEC-STD-033.

  • LS Q976

    15 Version 1.5 | 2020-02-11

    Schematic Transportation Box 9)

    Dimensions of Transportation BoxWidth Length Height

    260 ± 5 mm 230 ± 5 mm 85 ± 5 mm

  • LS Q976

    16 Version 1.5 | 2020-02-11

    Chip Technology: 1: TSN 3: standard InGaN 4: AlGaAs 6: standard InGalP E: ThinGaN & package with 8 kV ESD stability G: NOTA, Powerflip, ThinGaN

    Encapsulant Type / Lens Properties 1: focusing lens (=20°) 7: clear resin or white volume conversion 8: white volume conversion 9: clear resin

    Wavelength Emission Color Color coordinates according (λdom typ.) CIE 1931/Emission color: B: 470 nm blue W: white S: 633 nm super red T: 528 nm true green Y: 587 nm yellow A: 617 nm amber R/J: 625 nm red H: 645 nm hyper-red O: 606 nm orange G: 570 nm green L: Light emitting diode

    Package Type Q: CHIPLED 0603 / 0402 R: CHIPLED 0805 N: CHIPLED 1206 /

    CHIPLED with lens

    Lead / Package Properties 1: footprint: 0603 / height: 0.6 mm 3: footprint: 0603 / height: 0.35 mm 9: standard H: footprint: 0402 / height: 0.35 mm

    Type Designation System

    L B Q H 9 G

  • LS Q976

    17 Version 1.5 | 2020-02-11

    NotesThe evaluation of eye safety occurs according to the standard IEC 62471:2006 (photo biological safety of lamps and lamp systems). Within the risk grouping system of this IEC standard, the device specified in this data sheet falls into the class exempt group (exposure time 10000 s). Under real circumstances (for expo-sure time, conditions of the eye pupils, observation distance), it is assumed that no endangerment to the eye exists from these devices. As a matter of principle, however, it should be mentioned that intense light sources have a high secondary exposure potential due to their blinding effect. When looking at bright light sources (e.g. headlights), temporary reduction in visual acuity and afterimages can occur, leading to irrita-tion, annoyance, visual impairment, and even accidents, depending on the situation.

    Subcomponents of this device contain, in addition to other substances, metal filled materials including silver. Metal filled materials can be affected by environments that contain traces of aggressive substances. There-fore, we recommend that customers minimize device exposure to aggressive substances during storage, production, and use. Devices that showed visible discoloration when tested using the described tests above did show no performance deviations within failure limits during the stated test duration. Respective failure limits are described in the IEC60810.

    For further application related information please visit www.osram-os.com/appnotes

  • LS Q976

    18 Version 1.5 | 2020-02-11

    Disclaimer

    Attention please!The information describes the type of component and shall not be considered as assured characteristics.Terms of delivery and rights to change design reserved. Due to technical requirements components may contain dangerous substances.For information on the types in question please contact our Sales Organization.If printed or downloaded, please find the latest version on the OSRAM OS website.

    PackingPlease use the recycling operators known to you. We can also help you – get in touch with your nearest sales office. By agreement we will take packing material back, if it is sorted. You must bear the costs of transport. For packing material that is returned to us unsorted or which we are not obliged to accept, we shall have to invoice you for any costs incurred.

    Product and functional safety devices/applications or medical devices/applicationsOSRAM OS components are not developed, constructed or tested for the application as safety relevant component or for the application in medical devices.OSRAM OS products are not qualified at module and system level for such application.

    In case buyer – or customer supplied by buyer – considers using OSRAM OS components in product safety devices/applications or medical devices/applications, buyer and/or customer has to inform the local sales partner of OSRAM OS immediately and OSRAM OS and buyer and /or customer will analyze and coordi-nate the customer-specific request between OSRAM OS and buyer and/or customer.

  • LS Q976

    19 Version 1.5 | 2020-02-11

    Glossary1) Brightness: Brightness groups are tested at a current pulse duration of 25 ms and a tolerance of

    ±11 %.2) Reverse Operation: Reverse Operation of 10 hours is permissible in total. Continuous reverse opera-

    tion is not allowed.3) Wavelength: Wavelengths are tested at a current pulse duration of 25 ms and a tolerance of ±1 nm.4) Forward Voltage: Forward voltages are tested at a current pulse duration of 1 ms and a tolerance of

    ±0.1 V.5) Thermal Resistance: Rth max is based on statistic values (6σ).6) Thermal Resistance: RthJA results from mounting on PC board FR 4 (pad size ≥ 5 mm² per pad)7) Typical Values: Due to the special conditions of the manufacturing processes of semiconductor devic-

    es, the typical data or calculated correlations of technical parameters can only reflect statistical figures. These do not necessarily correspond to the actual parameters of each single product, which could dif-fer from the typical data and calculated correlations or the typical characteristic line. If requested, e.g. because of technical improvements, these typ. data will be changed without any further notice.

    8) Characteristic curve: In the range where the line of the graph is broken, you must expect higher differ-ences between single devices within one packing unit.

    9) Tolerance of Measure: Unless otherwise noted in drawing, tolerances are specified with ±0.1 and dimensions are specified in mm.

    10) Tape and Reel: All dimensions and tolerances are specified acc. IEC 60286-3 and specified in mm.

  • LS Q976

    20 Version 1.5 | 2020-02-11

    Revision HistoryVersion Date Change

    1.4 2020-01-17 Dimensional Drawing Taping

    1.5 2020-02-11 Dimensional Drawing Taping

  • LS Q976

    21 Version 1.5 | 2020-02-11

    Published by OSRAM Opto Semiconductors GmbH Leibnizstraße 4, D-93055 Regensburg www.osram-os.com © All Rights Reserved.