Lecture 5a - Gigaloggigalogchip.com/uploads/3/4/9/4/34940339/lec05mismatches.pdfLecture 5a Cont....
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Technion 046188/2012 Lect 05a
Lecture 5a
Cont. Mismatches in Mixed Signal Circuits
Mismatches in CMOS devices.
Welcome to046188 Winter semester 2012Mixed Signal Electronic Circuits
Instructor: Dr. M. Moyal
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Technion 046188/2012 Lect 04
Summary lect. 2-4
Eq. and definitions
fRTkVnoise ∆⋅⋅⋅⋅= 42 Noise in a resistor
)/(09.41 HzVK η⋅=>Ω
fg
TkV
mnoisein ∆⋅
⋅⋅⋅•=
γ4)3/2(2_
Noise in a transistor (CMOS) f
fLW
TkKoV noisein ∆⋅
••
⋅⋅•=2
_
Technion 046188/2012 Lect 05a
One of the most critical parameters in Mixes signal design.
Mostly ignored with normal simulators
MISMATCHES
Technion 046188/2012 Lect 04
Mismatches- modelling-”Pelgrom rule”
Technion 046188/2012 Lect 05a
MISMATCHES IN TRANSISTORS
First test:
Is it a current source mode ?Is it a voltage mode device ?Is it a switch ?
Mixed signal design must address:
Can we ignore/neglect the error ?
If not can we “calibrate” or fix the errors ?
Technion 046188/2012 Lect 05a
Mismatches- Vth.
Process deviation: threshold voltage is highly process dependent:Vth=VFB - Qss/Cox + Vsub +2|Фp| + |Qd|/Cox
where:VFB- flat band voltage,Qss – surface charge per unit area, Vsub – substrate voltage,2| Фp| - voltage required for strong inversion, doping gradientsQd – depletion charge per unit area in the depletion regionCox – oxide capacitance per um2, depends on oxide thicknessAll of them except Vsub are process dependent and randomly or graded
distributed
Layout mismatch: Voltage drop on along power line can cause graded error
Technion 046188/2012 Lect 05a
Mismatches- History
First belief was based on measured data :Very L dependent and Very W dependent
Low L Vt. goes down – so variations is largeLow W Vt. goes up – so variation is large
Today Pelgrom law define most mismatches as function of area WxL
effeff
TLW
CV
×=∆ 1)(σ
Vt L
1 /
delVt
W
W,L
Technion 046188/2012 Lect 05a
Note on C 1
C1 is in today design ~ 2-10 mV for W x L =1 ( u x u)
C1 has strong dependency on manufacturing – we do not have much control
C1 follow ~ 1.5 tox (in nm-> mv) as a “rule of thumb” – use thin oxide devices
C1 can be different for different layouts – we have control
Example for C1.
~ 3nm Tox --_ 90nm process ~ 4.5mv x um0.18um process tox=4nm ~ 6mv x um3.3v process, tox~7nm ~ 10mv x um
Technion 046188/2012 Lect 05a
V Mismatches- Saturation
( ) ( ) )(**)(2
22222
2
L
LIVVVI
DTTGSD
∆+∆−= σσ
βσ
L
WCox ⋅⋅= µβ
effeff
TLW
CV
×=∆ 1)(σ
“never mind” this.. Create a design model
w/l
vrfv1
w/l
Irf
amplifiers, comparators offset.
increase area for better resultsWhat happen to input cap ? effeff LW ×
∝1
Technion 046188/2012 Lect 05a
I Mismatches- Saturation: method I 1
( )( ) ( ) )(
)(2
)( 22
2
22
2
2
L
LV
VVL
LV
II
IT
TGS
T
D
D
D
∆+∆
−
∆+∆= = σσσσ
βσ
Technion 046188/2012 Lect 05a
I Mismatches- Saturation- second method
In spice- monte-carlo canAdd also w and L mismatches
Technion 046188/2012 Lect 05a
Mismatches/offset Vs. L, W,
Technion 046188/2012 Lect 05a
w/l
vrfv1
w/l
Irf
effeff
TLW
CV
×=∆ 1)(σ
w/l w/l
Irf
effeff
TLW
CV
×=∆
2)( 1σ
w/l
v1
w/l
w/l w/l
Irf
effeff
TLW
CV
×=∆
2)( 1σ
w/l
v1vrf
w/lw/lw/l w/l w/l
Example: Mismatches/offset
4x transistor area = ½ offset improvement
vrf
Technion 046188/2012 Lect 03
Technion 046188/2012 Lect 5a
END lecture 5a
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