Flatness ･ Light Point Defects - Sumitomo Electric...
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８ Substrates Flatness ･ Light Point Defects Flatness ･ Light Point Defects Flatness GaAs InP Product Laser Diodes Semi-Insulating Guaranteed （Ref.） Typical Guaranteed （Ref.） Typical Size ≦２ ≦５ ≦１０ ≦１０ ≦１５ ≦６ ≦６ ≦８ ≦６ ≦５ ４"φ ６"φ ２"φ ３"φ ２"φ ３"φ ４"φ １．３ １．５ ７ ６ １０ ４ ４ ４ ３ ３ ≦５ ≦１０ ≦１０ ≦１５ ≦１５ ≦９ ≦９ ≦１０ ≦１０ ≦１０ ２ ３ ７ ８ １０ ５ ５ ７ ５ ５ ≦２ ≦４ ____ ____ １２ ６ ６ ６ ４ ５ １．２ １．８ ____ ____ １０ ４ ４ ５ ３ ３ PLTV（％） Guaranteed （Ref.） Typical Guaranteed （Ref.） Typical ≧９０ ≧９０ ____ ____ ____ ____ ____ ____ ____ ____ Guaranteed ≦１（１５㎜□） ≦ １．５ （２０㎜□） ____ ____ ____ ____ ____ ____ ____ ____ ０．６ ０．７ ____ ____ ____ ____ ____ ____ ____ ____ Surface Finish P/P P/P P/LE P/E P/LE P/P P/LE P/P P/P Warp（μm） LTV（μm） TIR（μm） TTV（μm） Definitions of Flatness TTV TIR LTV PLTV Warp Total Thickness Variation： The difference between the highest and the lowest elevation of the top surface of a clamped wafer. The back surface referenced. Total Indicated Reading： The difference between the highest point above and the lowest point below the front surface referenced focal plane of a clamped wafer. 3 points on the front surface generally used. Local Thickness Variation: The difference between the highest point and the lowest point within a site of the top surface of a clamped wafer. The back surface referenced. Percent LTV： Percentage of sites on a wafer within the specified LTV value. The difference between the highest point above and the lowest point below the front surface referenced focal plane of an unclamped wafer. A least square fit on the front surface generally used. Light Point Defects Flatness Definitions of Flatness Light Point Defects Product InP GaAs VB （Semi－Insulating） Defect Size Size Guaranteed ≦４０ ≦１００ ≦２０ ≦３０ ≦３０ （Ref.）Typical １０ ３０ ７ １０ １０ ≧０．４ μm ≧１．２ μm 2 ４"φ ６"φ ２"φ ３"φ ４"φ Pcs./Wafer TTV Referenced Focal Plane A B TIR ＝｜A｜＋｜B｜ LTV Focal Plane Focal Plane Focal Plane Referenced Focal Plane A B Warp ＝｜A｜＋｜B｜
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Transcript of Flatness ･ Light Point Defects - Sumitomo Electric...
８ Substrates
Flatness ･ Light Point DefectsFlatness ･ Light Point Defects
Flatness
GaAs
InP
Product
Laser
Diodes
Semi-Insulating
Guaranteed（Ref.） Typical
Guaranteed（Ref.） Typical
Size
≦２
≦５
≦１０
≦１０
≦１５
≦６
≦６
≦８
≦６
≦５
４"φ
６"φ
２"φ
３"φ
２"φ
３"φ
４"φ
１．３
１．５
７
６
１０
４
４
４
３
３
≦５
≦１０
≦１０
≦１５
≦１５
≦９
≦９
≦１０
≦１０
≦１０
２
３
７
８
１０
５
５
７
５
５
≦２
≦４ ____
____
１２
６
６
６
４
５
１．２
１．８ ____
____
１０
４
４
５
３
３
PLTV（％） Guaranteed
（Ref.） Typical
Guaranteed（Ref.） Typical
≧９０
≧９０ ____
____
____
____
____
____
____
____
Guaranteed
≦１（１５㎜□）
≦１．５（２０㎜□） ____
____
____
____
____
____
____
____
０．６
０．７ ____
____
____
____
____
____
____
____
Surface Finish
P/P
P/P
P/LE
P/E
P/LE
P/P
P/LE
P/P
P/P
Warp（μm） LTV（μm） TIR（μm） TTV（μm）
Definitions of Flatness
TTV
TIR
LTV
PLTV
Warp
Total Thickness Variation： The difference between the highest and the lowest elevation of the top surface of a clamped wafer. The back surface referenced.
Total Indicated Reading： The difference between the highest point above and the lowest point below the front surface referenced focal plane of a clamped wafer. 3 points on the front surface generally used.
Local Thickness Variation: The difference between the highest point and the lowest point within a site of the top surface of a clamped wafer. The back surface referenced.
Percent LTV： Percentage of sites on a wafer within the specified LTV value.
The difference between the highest point above and the lowest point below the front surface referenced focal plane of an unclamped wafer. A least square fit on the front surface generally used.
Light Point Defects
Flatness
Definitions of Flatness
Light Point Defects
Product
InP
GaAs VB （Semi－Insulating）
Defect SizeSizeGuaranteed
≦４０
≦１００
≦２０
≦３０
≦３０
（Ref.）Typical
１０
３０
７
１０
１０
≧０．４μm
≧１．２μm2
４"φ
６"φ
２"φ
３"φ
４"φ
Pcs./Wafer
TTV
Referenced Focal Plane
AB TIR ＝｜A｜＋｜B｜
LTVFocal Plane
Focal Plane
Focal Plane
Referenced Focal Plane
AB Warp ＝｜A｜＋｜B｜
９ Substrates
Categories of Off-OrientationCategories of Off-Orientation
Clockwise(EJ)
Example of off－orientation
Surface
Orientation
（１００）χ°off
toward
Off－Orientation
General
nearest
〈１１０〉
nearest
〈１１１〉A
nearest
〈１１１〉B
Specific
〔１１０〕
〔１１０〕
〔１０１〕
〔１０１〕
〔１１１〕
〔０１１〕
〔１１１〕
〔０１１〕
〔１１１〕
〔０１１〕
〔１１１〕
〔０１１〕
α
４５°
２２５°
１３５°
３１５°
０°
１８０°
９０°
２７０°
Case
A
B
C
D
E
F
G
H
Counter Clockwise(US)Surface
Orientation
（１００）χ°off
toward
Off－Orientation
General
nearest
〈１１０〉
nearest
〈１１１〉A
nearest
〈１１１〉B
Specific
〔１０１〕
〔１０１〕
〔１１０〕
〔１１０〕
〔１１１〕
〔０１１〕
〔１１１〕
〔０１１〕
〔１１１〕
〔０１１〕
〔１１１〕
〔０１１〕
α
４５°
２２５°
１３５°
３１５°
９０°
２７０°
０°
１８０°
Case
I
J
K
L
M
N
O
P
Vector Normal to the Slice Surface
Case：G →（１００）θ°off toward〔１１１〕
Example of off－orientation
Clockwise(EJ)
Planar Representation of Cubic FormPlanar Representation of Cubic Form
Example of off－orientation
Planar Representation of Cubic FormPlanar Representation of Cubic Form
Counter Clockwise(US)
Example of off－orientationCase：P →（１００）θ°off toward〔１１１〕
off－orientation slice
〔１１１〕Vector Normal to the（１１１）planeVector Normal to the（１００）plane
Projection of〔１１１〕on（１００）plane
OF
IF（１００）
α
OF
OF
IF
IF
（１１０）
（１１１）
（１１１）
（１０１） （１００）
（１０１） （１１０）
〔０１１〕 〔０１１〕
〔０１１〕
〔００１〕
〔０１０〕 〔００１〕
〔０１０〕
〔０１１〕
Face of Element Ⅲ（Ga, In）
Face of Element Ⅴ （As, P）
（１１１）
（０１１）
（０１０） （００１）
（１１０） （１０１）
α
OF
OF
IF
IF
（１０１）
（１１１）
（１１１）
（１１１）
（１１１）
（１１０）
（１１０） （１０１）
〔０１１〕 〔０１１〕
〔０１１〕
〔０１０〕
〔００１〕 〔０１０〕
〔００１〕
〔０１１〕
Face of Element Ⅴ（As, P）
Face of Element Ⅲ （Ga, In）
（１１１）
（０１１）
（００１） （０１０）
（１０１） （１１０）
（１００）
（１００）
（１００）
（１１１） Round Wafer （Mirror Face）
Round Wafer （Mirror Face）
θ°
Vector Normal to the Slice Surface
off－orientation slice
〔１１１〕Vector Normal to the（１１１）planeVector Normal to the（１００）plane
Projection of〔１１１〕on（１００）plane
OF
IF
（１００）
θ°
（１１１）
