Dynamic Mechanical Analysis (DMA) Basics and …ring/ChE 5655 Chip...

Dynamic Mechanical Analysis (DMA) Basics and Beyond

Dr. Lin LiThermal AnalysisPerkinElmer Inc.

April 2000

ε∗ ω= Σ(∆εβ/1+ιωτβ)

molecular structure

processing conditions

product properties

MaterialBehavior

The DMA lets you relate:

Force Motor

Temperature Enclosure

LVDT

Core Rod

Interchangeable

FurnaceHeat Sink/Cooling System

Measuring System

How the DMA works:

DMA Structure in general

CoilMagnet

!Constant inputs and outputs function as in the TMA

!A sine wave current is added to the force coil

!The resultant sine wave voltage of the LVDT is compared to the sine wave force

!The amplitude of the LVDT is related to the storage modulus, E' via the spring constant, k.

!The phase lag, δ, is related to the E" via the damping constant, D.

Outstanding Flexibility 1: Multiple Geometries

Extension

Compressive Shear

Flexure

Parallel PlateCup & PlateTray & PlateSintered Plates3 pt. Bending4 pt. BendingASTM FlexureDual CantileverSingle CantileverExtensionShear SandwichCoaxial CylinderPaper FoldCup & Plate

Why?

3456789101112

Log

E’

1 mm

20 mm

20 mm

5 mm

Stress Causes Strain...

Lo L

Cauchy orEngineering Strain

L-Lo = ∆L

Henchy or True Strain εεεε = ln (∆L/Lo)

εεεε = ∆L/Lo

Kinetic Theoryof Rubber Strain εεεε = 1/3{L/Lo-(Lo/L)2}

Kirchhoff Strain

Murnaghan Strain

εεεε = 1/2{ (L/Lo)2-1}

εεεε = 1/2{1-(Lo/L)2}

The different definitions of tensile strainbecome equivalent at very small deformations.

The Elastic Limit: Hooke’sLaw

=

Strain increaseswith increasing

Stress

σσσσ

ε ε ε ε

slope = k

Real vs... Hookean Stress-Strain Curves

4.0 8.0 12.0 16.0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

Thu Apr 14 16:34:38 1994

Slope 359171.32 Pa/%

Stre

ss (P

a x

107 )

KPMStrain (%)

Slope 1642965.02 Pa/%

Curve 1: DMA Creep Recoveryin Parallel PlateFile info: Drssr90R.2Thu Apr 14 15:16:52 1994Sample Height:3.359 mmCreep Stress: 2600.0mN Recovery Stress: 1.0mN Dresser 90 Durameter

PERKIN-ELMER7 Series ThermalAnalysis System

TEMP1: 20.0 C TIME1: 5.3 min

LimitingModulus

Real behavior

HookeanBehavior

σσσσ

εεεε

The Viscous Limit: NewtonianBehavior

σσσσ

γ γ γ γ .

The speed at which the fluid flows through the holes (the strain rate)

increases withstress!!!

slope = η

Viscosity Effects• Newtonian behavior is linear and the

viscosity is independent of rate.• Pseudoplastic fluids get thinner as shear

increases.• Dilatant Fluids increase their viscosity as

shear rates increase.• Plastic Fluids have a yield point with

pseudoplastic behavior.• Thixotrophic and rheopectic fluids show

viscosity-time nonlinear behavior. For example, the former shear thin and then reform its gel structure.

γ γ γ γ

ττττ

.

Polymers are Non-NewtonianFluids!!!

• At low shear rates, the viscosity is controlled by MW. The material showsNewtonian behavior

• Viscosity shows a linear dependence on rate above the ηo region.

• At high rates, the material can no longer shear thin and a second plateau is reached.

η ηηη

γγγγ.

Zero Shear Plateau ~ ηηηηo

Infinite Shear Plateau ~ ηηηη∞

Linear Dependenceon Rate

Log

Log

Analyzing a Stress-Strain Curve

σσσσ

εεεε

linearregion nonlinear region

failure (εΒ, σΒ)

yield point (εy, σy)

Young’s modulus (E)E d

dL

L

= =σε

σε

The area underthe curve to this lineis the energy neededto break the material

Under Continuos Loads: Creep Recovery

• Applying a constant load for long times and removing it from a sample.

• Allows one to see the distortion under constant load and also how well it recovers.

Creep is a fundamental engineering test.

• Creep is used as a basic test for design.

• By looking at both the creep and recovery parts of the curve, we can begin to examine how polymers relax.

0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.00.0000

0.0005

0.0010

0.0015

0.0020

0.0025

-250.0

0.0

250.0

500.0

750.0

1000.0

1250.0

1500.0

1750.0

2000.0

2250.0

2500.0

Thu Apr 28 20:32:20 1994

Stra

in (%

)

DMA7 APPLICATIONS LABTime (minutes)

# 1 PTFE - CREEP/RELAXATION AT -5C:cr_ptfe-5Strain (%)

Curve 1: DMA Creep Recoveryin 3 Point BendingFile info: cr_ptfe-5 Wed Jun 29 15:31:18 1988Sample Height:3.300mmCreep Stress: 1.50e+06Pa Recovery Stress: 6.25e+02Pa PTFE - CREEP/RELAXATION


TEMP1: -15.0 C TIME1: 7.0 min

Forc

e (m

N)

# 2 Force (mN)

Dynamic Stress

F (static)

Force

Time

Force (dynamic)

Phase angle = δ= δ= δ= δ

Stress

Time

material response

Strain =yo/y

Amplitude = k

Stress =FA

Why? Let’s bounce a ball.

E” ~ energy loss in internal motion

E’ ~ elasticresponse

All this is calculated from δ δ δ δ and k:

• From k, we calculate E’ (storage modulus)• From δ, we calculate E’’ (loss modulus)• then:

Tan δ = E”/E’E* = E’ + iE” = SQRT(E’2 + E”2)G* = E*/2(1+ν)η = 3G*/ω

To apply this to materials...

σσσσοοοο

ε ε ε ε οοοο

Dynamic Stress Scan Since each part of the ramp has a sine wave stress associated with it, we get:

tan δE*, E’, E”η

for each data point!!εεεεσσσσ

For example, DSS Curves

0.2 0.4 0.6 0.8 1.0

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

Thu Apr 28 20:28:00 1994

Vis

cosi

ty (P

a s

x 10

7 )

KPMStrain (%)

# 1 Dresser 70 Durameter:Drssr70DssComplex Viscosity (Pa s x 10 7)

Curve 1: DMA AC Stress Scanin Parallel PlateFile info: Drssr70DssThu Apr 14 16:44:41 1994Frequency: 1.00 Hz Stress Rate: 250.0mN/min

Tension: 110.000% Dresser 70 Durameter


TEMP1: 10.5 C TIME1: -1.2 min

# 2 Dresser 90 Durameter:Drssr90dss

Complex Viscosity (Pa s x 10 7)

0.2 0.4 0.6 0.8 1.00.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

Thu Apr 14 16:59:58 1994

Dyn

amic

Stre

ss (P

a x

106 )

KPMStrain (%)

Slope 1274361.04 Pa/%

Curve 1: DMA AC Stress Scanin Parallel PlateFile info: Drssr70DssThu Apr 14 16:44:41 1994Frequency: 1.00 Hz Stress Rate: 250.0mN/min

Tension: 110.000% Dresser 70 Durameter


TEMP1: 10.5 C TIME1: -1.2 min

Slope 6297938.16 Pa/%

Now, let’s induce temperature as a variable.

• We can heat the material under minimal load at a calibrated rate.

• This allows the material to change with temperature.

• These changes can be described in terms of free volume or relaxation times.

Free

Vol

ume

Thermomechanical Analysis as a starting Point.

50.0 75.0 100.0 125.0 150.0 175.00.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

6.0

6.5

7.0

Sun Nov 26 20:10:47 1995

Pene

tratio

n (m

m)

Temperature (C)

# 1 Tg by flex:TgflexPenetration (mm)

Onset 106.92 C

Curve 1: TMA in PenetrationFile info: Tgflex Tue Oct 10 16:21:08 1995

DC Force: 100.0 mNSample Height:4.180 mmTg by flex

PERKIN-ELMER7 Series Thermal Analysis System

TEMP1: 30.0 C TIME1: 0.0 min RATE1: 10.0 C/minTEMP2: 150.0 C

TMA - It’s all free volume.

70.0 80.0 90.0 100.0 110.0

1.70

1.75

1.80

1.85

1.90

1.95

2.00

2.05

2.10

Sun Nov 26 20:08:09 1995

Expa

nsio

n (m

m)

Temperature ( C)

# 1 cte :cteExpansion (mm)

Onset 105.53 CCx 2.948 x 10 -5 / C

Cx 2.195 x 10 -2 / C

Curve 1: TMA in ExpansionFile info: cte Tue Oct 10 16:46:51 1995

DC Force: 10.0 mNSample Height: 1.742 mmcte



Tg

FreeVolume

Occupied Volume

And it’s not just Tg.

0.0 50.0 100.0 150.0 200.0 250.0

11.98

12.00

12.02

12.04

12.06

12.08

12.10

12.12

12.14

12.16

12.18

12.20

Tue Feb 21 12:29:39 1995

Exte

nsio

n (m

m)

He/20psi/H/Chiller Tech.Support Lab/K.MenardTemperature ( C)

# 1 FIBER E:menard005Extension (mm)

Curve 1: TMA in ExtensionFile info: menard005 Tue Feb 21 12:28:20 1995

DC Force: 0.0 mNSample Height: 12.017 mmFIBER E



(the traditional way to do heat set)

Time Temperature Scans at a Fixed Frequency

• hold frequency constant and vary temperature or time at temperature

• allows detection of transitions in material• allows one to study cures • most sensitive method for finding Tg• can also get changes in dimension (TMA)

while collecting DMA data• Best probe of polymer relaxations as function

of temperature

Idealized Multi-Event DMA Scan

E’

Temperature

Tm - melting (1)

Rubbery Plateau (2)

Tg - glass transition (3) ααααΒ (4)Β (4)Β (4)Β (4)

(6)(6)(6)(6) (5)(5)(5)(5) (4)(4)(4)(4) (3)(3)(3)(3) (2)(2)(2)(2) (1) (1) (1) (1) local bend side gradual large chainmotions and groups main scale slippage

stretch chain chain

γ (5)γ (5)γ (5)γ (5)(6)(6)(6)(6)

In more detail...

56789

10

Glassy Rubbery

Cross-linked

Temperature

A

B

CD

E

Deformation

MolecularMotion

UnstrainedStateStrainedState

E D C B AHookeanBehavior

SecondTransition

PrimaryTransition Highly Visco Elastic Flow

(rubbery)(gamma) (beta) (alpha)

Bend &StretchBonds

SideGroups

MainChain

GradualMain Chain Large

Scale MobilityChain

Slipping

Increasing

F

FSecondaryDispersion

LocalizedMotion

R. Seymour, 1971

(melt)

34

11Lo

gM

odul

us(P

a)

Crystal-crystal slip

Crystalline Polymer

Common changes show as:

E’tan δδδδ

MW MWD Crosslink Density Crystallinity

Tg are easily seen, as in PET Film

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

-100.0 0.0 100.0 200.0 300.0

0.0

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

Sun Nov 26 21:02:11 1995

Mod

ulus

(Pa

x 10

9 )

# 2 Storage Modulus (Pa x 10 9 )

Onset 83.29 Ctan

Temperature ( C)

# 1 pet film:demofilmtan

Onset 107.82 C

Onset 79.35 C

Curve 1: DMA Temp/Time Scan in ExtensionFile info: demofilm Wed Oct 11 17:06:48 1995Frequency: 1.00 Hz Amplitude: 21.949u

Tension: 110.000% pet film


TEMP1: -100.0 C TIME1: 0.0 min RATE1: 10.0 C/minTEMP2: 250.0 C

or in PP fishing line.

0.0

1.0

2.0

3.0

4.0

5.0

6.0

7.0

8.0

-100.0 -50.0 0.0 50.0 100.0 150.0 200.0

0.0

0.5

1.0

1.5

2.0

2.5

Sun Nov 26 21:24:35 1995

Mod

ulus

(Pa

x 10

9 )

# 2 Storage Modulus (Pa x 10 9) ta

n (x

10

-1)

Temperature ( C)

# 1 fishing line:1116942tan (x 10 -1 )

Curve 1: DMA Temp/Time Scan in ExtensionFile info: 1116942 Wed Nov 16 13:20:39 1994Frequency: 1.00 Hz Dynamic Stress: 200.0mN

Static Stress: 300.0mN fishing line



Sample prep can be minimal if only temperatures are needed.

Transitions are clearly seen in highly crosslinked samples

0.0 50.0 100.0 150.0 200.0 250.00.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

Thu Jun 23 13:45:10 1994

Mod

ulus

(Pa

x 10

9 )

heavy xlink kmTemperature ( C)

# 1 epoxyresin:afriedli.1Storage Modulus (Pa x 10 9 )

Curve 1: DMA Temp/Time Scan in 3 Point BendingFile info: afriedli.1 Thu Feb 17 12:14:11 1994Frequency: 1.00 Hz Dynamic Stress: 800.0mN

Static Stress: 1000.0mN epoxyresin



tan

# 2 tan

This Tg is undetectable in the DSC !!!!!!

as well as in blends.

-150.0 -100.0 -50.0 0.0 50.0 100.0 150.0 200.010 6

10 7

10 8

10 9

0.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

Sun Nov 26 20:54:43 1995

Mod

ulus

(Pa)

K66:22T914 APPLICATION LABORATORYTemperature ( C)

# 1 STYRENE BUTADIENE RUBBER:sbr14Storage Modulus (Pa) L

Curve 1: DMA Temp/Time Scan in 3 Point BendingFile info: sbr14 Thu Feb 15 10:45:19 1990Frequency: 1.00 Hz Dynamic Stress: 2.00e+05Pa

Tension: 110.000% STYRENE BUTADIENE RUBBE



tan

# 2 tan

It’s not always so simple:For example, crystal-crystals slips can cause α∗ transitions

-150.0 -100.0 -50.0 0.0 50.0 100.0

0.5

1.0

1.5

2.0

2.5

0.0

0.5

1.0

1.5

2.0

2.5

3.0

Sun Nov 26 20:58:36 1995

Mod

ulus

(Pa

x 10

9 )

AMP Flame Retardant Polypropylene KPMTemperature ( C)

# 1 LeBrun samples:AMPfrPP.1Storage Modulus (Pa x 10 9 )

Curve 1: DMA Temp/Time Scan in 3 Point BendingFile info: AMPfrPP.1 Wed Oct 27 13:49:06 1993Frequency: 1.00 Hz Dynamic Stress: 950.0mN

Static Stress: 1000.0mN LeBrun samples



tan

(x 1

0-1

)

# 2 tan (x 10 -1 )

Tg orAlpha

Tα*

Higher Order Transitions affect toughness

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

-150.0 -100.0 -50.0 0.0 50.0 100.0 150.00.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

5.5

Sat Oct 15 14:32:54 1994

LeBrun samples

tan

(x 1

0-1

)

Mod

ulus

(Pa

x 10

9 )

AMP good part 20% glass filled Nylon 6/6 KPMTemperature ( C)

Curve 1: DMA Temp/Time Scan in 3 Point BendingFile info: AMP66gp.1 Tue Oct 26 16:05:29 1993Frequency: 1.00 Hz Dynamic Stress: 190.0mN

Static Stress: 200.0mN LeBrun samples



β Transitions

Tg

Good Impact Strength

Poor

Impact was good if Tg/Tβ was 3 or less.

...and also define operating range.

-100.0 0.0 100.0 200.00.0

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

1.0

1.1

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

4.5

5.0

Sun Nov 26 20:13:53 1995

Mod

ulus

(Pa

x 10

10)

PE DMA7 R&D LABTemperature ( C)

# 1 EPOXY PC BOARD AT 7 Hz:gamma_1Storage Modulus (Pa x 10 10 )

Curve 1: DMA Temp/Time Scan in 3 Point BendingFile info: gamma_1 Thu Jun 30 02:17:24 1988Frequency: 7.00 Hz Dynamic Stress: 1.86e+06Pa

Static Stress: 1.86e+06Pa EPOXY PC BOARD AT 7 Hz



tan

(x 1

0-1

)

-> # 2 tan (x 10 -1 )

BetaTg

Operatingrange

It can get complex...

-200.0 -150.0 -100.0 -50.0 0.0 50.0 100.0 150.0 200.056789

10 9

2

3

4

56789

10 10

2

0.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

4.0

Sun Nov 26 20:59:14 1995

Mod

ulus

(Pa)

iNITIAL RUN B.CasselTemperature ( C)

# 1 NYLON MONOFILAMENT:T2n4ptgStorage Modulus (Pa) L

Curve 1: DMA Temp/Time Scan in ExtensionFile info: T2n4ptg Fri Jan 18 18:14:51 1991Frequency: 1.00 Hz Dynamic Stress: 1.00e+07Pa

Static Stress: 1.05e+07Pa NYLON MONOFILAMENT


TEMP1: -180.0 C TIME1: 0.0 min RATE1: 4.0 C/minTEMP2: 0.0 C TIME2: 0.0 min RATE2: 2.0 C/minTEMP3: 150.0 C

tan

(x 1

0-1

)

# 2 tan (x 10 -1 )

Tg or Tα

StressReliefTβTγ

Curing of Thermosets

• can be studied at constant temperature or by a temperature ramp

• can get minimum viscosity, gelation point (time), vitrification point, and activation energies from DMA curve

• can adapt instrument to do simultaneous DEA-DMA to follow cure to completion

• cure studies are not limited to polymeric systems but include food products like cakes and cookies

Analysis of a Cure by DMA

50.0 70.0 90.0 110.0 130.0 150.010 0

10 1

10 2

10 3

10 4

10 5

10 6

10 7

10 8

E’

E”

Mod

ulus

Τ

η∗

E’-E” Crossover ~ gelation point

vitrification point

Minimum Viscosity (time, length,temperature )

106 Pa ~ Solidity

Melting

Curing

QC can often be done by simply fingerprinting the resin.

25.0 50.0 75.0 100.0 125.0 150.00.0

0.5

1.0

1.5

2.0

2.5

3.0

3.5

η∗note the different slopes andthe different curve shapes

good

bad

Postcure studies allow process optimization:

Prop

erty

Postcure time vs... Tg and E’

0

20

40

60

80

100

120

140

160

180

200

0 2 4 6 8

TIME IN HOURS

E'@50 (E9 PA)

E' ONSET

TAN D PEAK

TAN D ONSET

tan

δ δδδ

Temperature

1.0

0.5

0.0

0 hours1 hour

2 hours

3 - 8 hours

150 200175

Frequency Scans

• hold temperature constant and vary frequency• allows one to look at trends in material• can estimate changes in MW and MWD• looks at both tack-like and peel-like behavior• can use data for Time Temperature Superposition

to extend frequency range or predict age life.

Frequency determines the type of response

10 -2 10 -1 10 0 10 110 3

10 4

10 5

10 6

10 7

10 3

10 4

10 5

10 6

10 7

Mod

ulus

(Pa)

Frequency (Hz)

Visc

osity

(Pa

s)

MoreLiquid

like

Moresolidlike

Flow dominates Elastic dominates

For example, two hot melt adhesives...

Τ

10 2

10 3

10 4

10 5

10 6

10 7

10 8

10 -4 10 -3 10 -2 10 -1 10 0 10 110 2

10 3

10 4

10 5

10 6

10 7

10 8

η∗ E’’

show affect of rate (peel vs.... tack)

good

bad

Creep can look at distortion under load,

0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.00.0000

0.0005

0.0010

0.0015

0.0020

0.0025

-250.0

0.0

250.0

500.0

750.0

1000.0

1250.0

1500.0

1750.0

2000.0

2250.0

2500.0

Thu Apr 28 20:32:20 1994

Stra

in (%

)

DMA7 APPLICATIONS LABTime (minutes)

# 1 PTFE - CREEP/RELAXATION AT -5C:cr_ptfe-5Strain (%)

Curve 1: DMA Creep Recovery in 3 Point BendingFile info: cr_ptfe-5 Wed Jun 29 15:31:18 1988Sample Height: 3.300 mm Creep Stress: 1.50e+06Pa Recovery Stress: 6.25e+02Pa PTFE - CREEP/RELAXATION


TEMP1: -15.0 C TIME1: 7.0 min

Forc

e (m

N)

# 2 Force (mN)

cyclic application of loads,

6.0

Time in minutes

% S

train

0.0 1.0 2.0 3.0 4.0 5.0

0.0

5.0

10.0

15.0

20.0

25.0

30.0

35.0

40.0

45.0

50.0

55.0

Good

Bad

Differences can be seen in good and bad samples and get more apparent with several cycles. Here the bad material is not flowing enough to fill the pores and

form a mechanical bond.

and with varying temperatures.

0.0 25.0 50.0 75.0 100.0 125.0 0.0

2.0

4.0

6.0

8.0

10.0

12.0

14.0

16.0

18.0

20.0

22.0

24.0

-250.0

0.0

250.0

500.0

750.0

1000.0

1250.0

1500.0

1750.0

2000.0

2250.0

2500.0

2750.0

Sun Nov 26 20:41:31 1995

Stra

in (%

)

KPMTime (minutes)

# 1 Dresser 90 D:DR90D2.1Strain (%)

Curve 1: DMA Creep Recovery in Parallel PlateFile info: DR90D2.1 Fri Jul 23 12:23:50 1993Sample Height: 2.836 mm Creep Stress: 2600.0mN Recovery Stress: 1.0mN Dresser 90 D


TEMP1: -50.0 C TIME1: 11.0 min RATE1: 10.0 C/minTEMP2: 0.0 C TIME2: 15.0 min RATE2: 10.0 C/minTEMP3: 50.0 C TIME3: 15.0 min RATE3: 10.0 C/minTEMP4: 100.0 C TIME4: 75.0 min

# 3 TP ( C)

Forc

e (m

N)

# 2 Force (mN)

And you can tabulate this stuff graphically...

• The time to 1/e percent recovery is the relaxation.

• This is a measure of how quickly a material recovers. (There is a lot more to this subject.)1/T

ττττ

Stress Relaxation

• By exploiting the special controls of the DMA-7e, we can run stress relaxation experiments.

• These look at how the force change for a sample kept at a set distortion as a function of time or temperature.

Time

Posi

tion

Experiment Starts

σσσσ

Sample would be distorted to y length and held.

Don’t forget the DMA-7e also does Stress Scans

• can do either static or dynamic ramps• static scans calculate Young’s modulus and

stress-strain curves• dynamic scans give material response to

increasing oscillatory forces:– get complex viscosity and modulus for each data point– can look at changes in elasticity (E’) and lag (phase angle) with

increasing stress

• Both methods are fast tests for QC applications after the material has been fully characterized by other DMA modes.

Specialized Testing is Possible...

The design of the DMA-7e makes it possible to do:

Time-Temperature Superposition (TTS)DEA/DMA

Tests in SolutionMicroscopic DMA

Photo DMADMA-?

PP fibers in solvent

20.0 40.0 60.0 80.0 100.00.0

25.0

50.0

75.0

100.0

125.0

150.0

175.0

200.0

Forc

e in

mN

Temperature in C

xylene

iso-octane

air

water

To Review, DMA ties together...molecular structure

processing conditions

product properties

Molecular weightMW DistributionChain BranchingCross linkingEntanglementsPhasesCrystallinityFree VolumeLocalized motionRelaxation Mechanisms Stress

StrainTemperatureHeat HistoryFrequencyPressureHeat set

MaterialBehavior

Dimensional StabilityImpact properties

Long term behaviorEnvironmental resistance

Temperature performanceAdhesion

TackPeel

Conclusions• DMA allows you to preform a wide range of

tests from sensitive probes of molecular structure to model studies.

• the DMA-7e allows operation as six different instruments to maximize flexibility.

• Data can be overlayed with DSC, TGA, TMA, and DTA for easier analysis.

References: Books• Menard, DMA: Introduction to the Technique, Its Applications and Theory,

CRC Press, 1999.• Brostow et a., Failure of Plastics, Hanser, 1986.• Ferry, Viscoelastic Properties of Polymers, Wiley, 1980.• Gordon et al., Computer Programs for Rheologists, Hanser, 1995.• Gol'dman, Prediction of Deformation Properties of Polymeric and Composite

Materials,, ACS, 1994.• Mascosko, Rheology, VCH, 1993.• Matsouka, Relaxation Phenomena in Polymers, Hanser, 1993.• McCrum et al, Anelastic and Dielectric Properties of Polymeric Solids, Dover,

1992 (reprint of 1967 edition).• Nielsen et al., Mechanical Properties of Polymers and Composites, Dekker,

1994.• Sperling, Introduction to Physical Polymer Science, Academic Press, 1994.• Ward et al., Introduction to Mechanical Properties of Solid Polymers, Wiley,

1993.

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