Datasheet - STL7LN65K5AG - Automotive-grade N-channel 650 V, … · 2 Electrical characteristics....
Transcript of Datasheet - STL7LN65K5AG - Automotive-grade N-channel 650 V, … · 2 Electrical characteristics....
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12
3 4
PowerFLAT 5x6 VHV
AM15540v6
5678
1 2 3 4
Top View
D(5, 6, 7, 8)
G(4)
S(1, 2, 3)
FeaturesOrder code VDS RDS(on) max. ID
STL7LN65K5AG 650 V 1.15 Ω 5 A
• AEC-Q101 qualified • Industry’s lowest RDS(on) x area• Industry’s best FoM (figure of merit)• Ultra-low gate charge• 100% avalanche tested• Zener-protected
Applications• Switching applications
DescriptionThis very high voltage N-channel Power MOSFET is designed using MDmeshK5 technology based on an innovative proprietary vertical structure. The result isa dramatic reduction in on-resistance and ultra-low gate charge for applicationsrequiring superior power density and high efficiency.
Product status link
STL7LN65K5AG
Product summary
Order code STL7LN65K5AG
Marking 7LN65K5
Package PowerFLAT 5x6VHV
Packing Tape and reel
Automotive-grade N-channel 650 V, 0.95 Ω typ., 5 A, MDmesh K5 Power MOSFET in a PowerFLAT 5x6 VHV package
STL7LN65K5AG
Datasheet
DS13267 - Rev 2 - November 2020For further information contact your local STMicroelectronics sales office.
www.st.com
https://www.st.com/en/product/STL7LN65K5AG?ecmp=tt9470_gl_link_feb2019&rt=ds&id=DS13267
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1 Electrical ratings
Table 1. Absolute maximum ratings
Symbol Parameter Value Unit
VGS Gate-source voltage ± 30 V
ID (1) Drain current (continuous) at TC = 25 °C 5 A
ID (1) Drain current (continuous) at TC = 100 °C 3.4 A
ID (2) Drain current (pulsed) 20 A
PTOT Total power dissipation at TC = 25 °C 79 W
dv/dt (3) Peak diode recovery voltage slope 4.5V/ns
dv/dt (4) MOSFET dv/dt ruggedness 50
Tstg Storage temperature range- 55 to 150 °C
TJ Operating junction temperature range
1. Limited by maximum junction temperature.2. Pulse width limited by safe operating area.3. ISD ≤ 5 A, di/dt 100 A/μs; VDS peak < V(BR)DSS,VDD= 520 V.
4. VDS ≤ 520 V.
Table 2. Thermal data
Symbol Parameter Value Unit
RthJA Thermal resistance, junction-to-case 1.58 °C/W
RthJB (1) Thermal resistance, junction-to-board 59 °C/W
1. When mounted on 1inch² FR-4 board, 2 oz Cu.
Table 3. Avalanche characteristics
Symbol Parameter Value Unit
IAR Avalanche current, repetitive or not repetitive (pulse width limited by Tjmax) 1.5 A
EAS Single pulse avalanche energy (starting Tj = 25 °C, ID = IAR, VDD = 50 V) 200 mJ
STL7LN65K5AGElectrical ratings
DS13267 - Rev 2 page 2/16
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2 Electrical characteristics
TC = 25 °C unless otherwise specified.
Table 4. On/off states
Symbol Parameter Test conditions Min. Typ. Max. Unit
V(BR)DSS Drain-source breakdown voltage VGS = 0 V, ID = 1 mA 650 V
IDSS Zero gate voltage drain current
VGS = 0 V, VDS = 650 V 1 µA
VGS = 0 V, VDS = 650 V,TC = 125 °C (1)
50 µA
IGSS Gate-body leakage current VDS = 0 V, VGS = ±20 V ±10 µA
VGS(th) Gate threshold voltage VDS = VGS, ID =100 µA 3 4 5 V
RDS(on) Static drain-source on-resistance VGS = 10 V, ID = 2.5 A 0.95 1.15 Ω
1. Defined by design, not subject to production test.
Table 5. Dynamic
Symbol Parameter Test conditions Min. Typ. Max. Unit
Ciss Input capacitance
VDS= 100 V, f = 1 MHz, VGS = 0 V
- 270 - pF
Coss Output capacitance - 22 - pF
Crss Reverse transfer capacitance - 0.5 - pF
Co(er) (1)Equivalent capacitance energyrelated
VDS = 0 to 520 V, VGS = 0 V- 20 - nC
Co(tr) (2)Equivalent capacitance timerelated - 57 - nC
RG Intrinsic gate resistance f = 1 MHz, ID=0 A - 7.5 - Ω
Qg Total gate chargeVDD = 520 V, ID = 5 A, VGS = 0to 10 V (see Figure 14. Test circuitfor gate charge behavior)
- 11.7 - nC
Qgs Gate-source charge - 2.7 - nC
Qgd Gate-drain charge - 7.3 - nC
1. Energy related is defined as a constant equivalent capacitance giving the same stored energy as Coss when VDS increasesfrom 0 to 80% VDSS
2. Time related is defined as a constant equivalent capacitance giving the same stored energy as Coss when VDS increasesfrom 0 to 80% VDSS
Table 6. Switching times
Symbol Parameter Test conditions Min. Typ. Max. Unit
td(on) Turn-on delay time VDD = 300 V, ID = 2.5 ARG = 4.7 Ω, VGS = 10 V(see Figure 13. Test circuit forresistive load switching timesand Figure 18. Switching timewaveform)
- 7.4 - ns
tr Rise time - 9.2 - ns
td(off) Turn-off delay time - 19.8 - ns
tf Fall time - 16.4 - ns
STL7LN65K5AGElectrical characteristics
DS13267 - Rev 2 page 3/16
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Table 7. Source-drain diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
ISD Source-drain current - 5 A
ISDM (1) Source-drain current (pulsed) - 20 A
VSD (2) Forward on voltage ISD= 5 A, VGS = 0 V - 1.6 V
trr Reverse recovery time ISD = 5 A, di/dt = 100 A/µs,VDD = 60 V (see Figure 15. Testcircuit for inductive load switchingand diode recovery times)
- 282 ns
Qrr Reverse recovery charge - 1.97 µC
IRRM Reverse recovery current - 14 A
trr Reverse recovery time ISD = 5 A, di/dt = 100 A/µs,VDD = 60 V, Tj = 150 °C(see Figure 15. Test circuit forinductive load switching and dioderecovery times)
- 415 ns
Qrr Reverse recovery charge - 2.70 µC
IRRM Reverse recovery current - 13 A
1. Pulse width is limited by safe operating area2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%
Table 8. Gate-source Zener diode
Symbol Parameter Test conditions Min. Typ. Max. Unit
V(BR)GSO Gate-source breakdown voltage IGS = ±1 mA, ID = 0 A 30 - V
The built-in back-to-back Zener diodes are specifically designed to enhance the ESD performance of the device.The Zener voltage facilitates efficient and cost-effective device integrity protection,thus eliminating the need foradditional external componentry.
STL7LN65K5AGElectrical characteristics
DS13267 - Rev 2 page 4/16
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2.1 Electrical characteristics (curves)
Figure 1. Safe operating area
GADG201120201305SOA
10 1
10 0
10 -1 10 -1 10 0 10 1 10 2 10 3
ID (A)
VDS (V)
tp = 100µs
tp = 1µs
tp = 10µs
tp = 1ms
tp = 10ms
Operation in this area is limited by R DS(on)
T j ≤150 °CT c = 25°C
single pulse
Figure 2. Maximum transient thermal impedance
GADG040320200927ZTH
10-6 10-5 10-4 10-3 10-2 tp (s)
ton
T
duty = ton / TRthJ-C = 1.58 °C/W
ZthJ-C(°C/W)
0.05
0.3
0.20.1
0.4
Single pulse
duty=0.5
10-1
10-2
100
Figure 3. Typical output characteristics
GIPG151220151129OCH
9
6
3
00 4 8 12 16
I D (A)
V DS (V)V GS = 6 V
V GS = 7 V
V GS = 8 V
V GS = 9 V
V GS = 11 VV GS = 10 V
Figure 4. Typical transfer characteristics
GIPG151220151128TCH
9
6
3
05 6 7 8 9 10
I D (A)
V GS (V)
V DS = 20 V
Figure 5. Typical gate charge characteristics
GADG270220201101QVG
600
500
400
300
200
100
0
12
10
8
6
4
2
00 2 4 6 8 10 12 14
VGS (V)
VDS (V)
Qg (nC)
Qgs Qgd
VDD = 520 VID = 5 A
Qg
Figure 6. Typical drain-source on-resistance
GIPG151220151128RID
1.2
1.0
0.8
0.60 1 2 3 4 5
R DS(on) (Ω)
I D (A)
V GS = 10 V
STL7LN65K5AGElectrical characteristics (curves)
DS13267 - Rev 2 page 5/16
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Figure 7. Typical capacitance characteristics
GADG260220201245CVR
103
102
101
100
10-110 -1 10 0 10 1 10 2
C (pF)
VDS (V)
Ciss
Coss
Crss
Figure 8. Normalized gate threshold vs temperature
GIPG151220151134VTH
1.2
1.0
0.8
0.6
0.4
0.2-50 0 50 100
V GS(th) (norm.)
T j (°C)
I D = 100 µA
Figure 9. Normalized breakdown voltage vs temperature
GIPG151220151133BDV
1.12
1.08
1.04
1.00
0.96
0.92
0.88-50 0 50 100
V (BR)DSS (norm.)
T j (°C)
I D = 1 mA
Figure 10. Normalized on-resistance vs temperature
GADG260220201247RON
2.5
2.0
1.5
1.0
0.5
0.0-75 -25 25 75 125
RDS(on) (norm.)
VGS = 10 V
TJ (°C)
Figure 11. Typical reverse diode forward characteristics
GIPG151220151156SDF
1.0
0.9
0.8
0.7
0.6
0.50 1 2 3 4 5
V SD (V)
I SD (A)
T j = -50 °C
T j = 25 °C
T j = 150 °C
Figure 12. Maximum avalanche energy vs temperature
GIPG151220151157EAS
200
150
100
50
0-50 0 50 100
E AS (m J)
T J (°C)
I D = 1.5 AV DD = 50 VSingle pulse
STL7LN65K5AGElectrical characteristics (curves)
DS13267 - Rev 2 page 6/16
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3 Test circuits
Figure 13. Test circuit for resistive load switching times
AM01468v1
VD
RG
RL
D.U.T.
2200μF VDD
3.3μF+
pulse width
VGS
Figure 14. Test circuit for gate charge behavior
AM01469v10
47 kΩ
2.7 kΩ
1 kΩ
IG= CONST 100 Ω D.U.T.
+pulse widthVGS
2200μF
VG
VDD
RL
Figure 15. Test circuit for inductive load switching anddiode recovery times
AM01470v1
AD
D.U.T.S
B
G
25 Ω
A A
B B
RG
GD
S
100 µH
µF3.3 1000
µF VDD
D.U.T.
+
_
+
fastdiode
Figure 16. Unclamped inductive load test circuit
AM01471v1
VD
ID
D.U.T.
L
VDD+
pulse width
Vi
3.3µF
2200µF
Figure 17. Unclamped inductive waveform
AM01472v1
V(BR)DSS
VDD VDD
VD
IDM
ID
Figure 18. Switching time waveform
AM01473v1
0
VGS 90%
VDS
90%
10%
90%
10%
10%
ton
td(on) tr
0
toff
td(off) tf
STL7LN65K5AGTest circuits
DS13267 - Rev 2 page 7/16
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4 Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,depending on their level of environmental compliance. ECOPACK specifications, grade definitions and productstatus are available at: www.st.com. ECOPACK is an ST trademark.
STL7LN65K5AGPackage information
DS13267 - Rev 2 page 8/16
https://www.st.com/ecopackhttp://www.st.com
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4.1 PowerFLAT 5x6 VHV mechanical data
Figure 19. PowerFLAT 5x6 VHV package outline
Bottom view
Side view
Top view
1 2 3 4
Pin 1identification
8 7 6 5
8 7 6 5
1 2 3 4Pin 1identification
8368144_REV_3
STL7LN65K5AGPowerFLAT 5x6 VHV mechanical data
DS13267 - Rev 2 page 9/16
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Table 9. PowerFLAT 5x6 VHV package mechanical data
Dim.mm
Min. Typ. Max.
A 0.80 1.00
A1 0.02 0.05
A2 0.25
b 0.30 0.50
D 5.00 5.20 5.40
E 5.95 6.15 6.35
D2 4.30 4.40 4.50
E2 2.40 2.50 2.60
e 1.27
L 0.50 0.55 0.60
K 2.60 2.70 2.80
STL7LN65K5AGPowerFLAT 5x6 VHV mechanical data
DS13267 - Rev 2 page 10/16
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Figure 20. PowerFLAT 5x6 VHV recommended footprint (dimensions are in mm)
8368144_REV_3_footprint
STL7LN65K5AGPowerFLAT 5x6 VHV mechanical data
DS13267 - Rev 2 page 11/16
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4.2 PowerFLAT 5x6 packing information
Figure 21. PowerFLAT 5x6 tape (dimensions are in mm)
(I) Measured from centreline of sprocket hole to centreline of pocket.
(II) Cumulative tolerance of 10 sprocket holes is ±0.20.
(III) Measured from centreline of sprocket hole to centreline of pocket
Base and bulk quantity 3000 pcsAll dimensions are in millimeters
8234350_Tape_rev_C
Figure 22. PowerFLAT 5x6 package orientation in carrier tape
Pin 1 identification
STL7LN65K5AGPowerFLAT 5x6 packing information
DS13267 - Rev 2 page 12/16
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Figure 23. PowerFLAT 5x6 reel
STL7LN65K5AGPowerFLAT 5x6 packing information
DS13267 - Rev 2 page 13/16
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Revision history
Table 10. Document revision history
Date Version Changes
04-Mar-2020 1 First release.
20-Nov-2020 2Updated Figure 1. Safe operating area.
Minor text changes.
STL7LN65K5AG
DS13267 - Rev 2 page 14/16
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Contents
1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2
2 Electrical characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .3
2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .7
4 Package information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .8
4.1 PowerFLAT 5x6 VHV mechanical data. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
4.2 PowerFLAT 5x6 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
STL7LN65K5AGContents
DS13267 - Rev 2 page 15/16
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© 2020 STMicroelectronics – All rights reserved
STL7LN65K5AG
DS13267 - Rev 2 page 16/16
http://www.st.com/trademarks
FeaturesApplicationsDescription1 Electrical ratings2 Electrical characteristics2.1 Electrical characteristics (curves)
3 Test circuits4 Package information4.1 PowerFLAT 5x6 VHV mechanical data4.2 PowerFLAT 5x6 packing information
Revision history