Copyright 2011 Elsevier Inc. All rights reserved. Chapter 1 Jin W. Lee.

Copyright 2011 Elsevier Inc. All rights reserved.

Chapter 1

Jin W. Lee


FIGURE 1.1 Snapshots from MD simulation of the collision between a bullet particle (dark blob) and a contaminant particle (light blob) at three different times for two different

bullet velocities: (a) Vx = Vz = 2.0(ε/m)1/2 (316 m/s); (b) Vx = Vz =3.0(ε/m)1/2 (474 m/s)


FIGURE 1.2 Snapshots from MD simulation of the collision between a bullet particle (dark blob) and a contaminant particle (light blob) at three different times, when the bullet kinetic energy is twice as high as in Figure 1.1 but at three different combinations of mass

and velocity: (a) 2m and V0; (b) m and 2V0; (c) m/2 and 2V0


FIGURE 1.3 Time variation of kinetic energy of bullet and contaminant particles (a) and the center of mass velocity of the contaminant particle before and after collision (b); 45, Vx = 3.0 (474 m/s) and Vz = -3.0. 1 = 2.15 ps. ‘CP’ refers to contaminant particle, and in (a) the solid black line is for a fragile bullet and the dotted line is for an artificial hard bullet


FIGURE 1.4 Saturation curves (lines) and nucleation onset points (symbols) for argon (dark dots) and nitrogen (light dots). Vertical lines are the solidification lines, and the curved lines are the sublimation and vaporization lines.


FIGURE 1.5 Particle generation by pure nitrogen expansion starting at P0, N2 = 3000 Torr and T0 = 110 K: (a) the expansion path plotted on the PT diagram; (b) distribution of nucleation rate; (c) the growth paths of the nuclei generated at corresponding axial locations of (b)


FIGURE 1.6 Schematic of the setup for the supersonic nozzle for aerosol cleaning


FIGURE 1.7 SEM images of the dents on a wafer surface coated with photoresist film: (a) by the particle beam generated by homogeneous nucleation and growth through the long contoured nozzle (tiny black dots), and (b) by liquid atomization through the short nozzle


FIGURE 1.8 SEM images before (left) and after (right) cleaning. Al2O3 particles on Si surface and argon stagnation pressure of 1500 Torr (top) and 1850 Torr (bottom)


FIGURE 1.9 Cleaning of TiO2 particles on Si surface with argon particles generated at 1850 Torr and 95 K at four different chamber pressures: (a) 150 Torr, (b) 100 Torr, (c) 50 Torr, and (d) 10 Torr. Image before cleaning is similar to the left figure of Figure 1.10


FIGURE 1.10 SEM images for TiO2 particles on Si surface before cleaning (left) and after cleaning with argon particles generated at 1500 Torr (middle) and 1850 Torr (right)


FIGURE 1.11 SEM images before (left) and after (right) cleaning of Al2O3 particles in a 1 1 m trench using argon particles generated at 1850 Torr


FIGURE 1.12 SEM image (a) before and (b) after cleaning with the short nozzle. Al2O3 particles on Si surface and 1:1 Ar/He mixture at 3000 Torr and 95 K


FIGURE 1.13 SEM image (a) before and (b) after cleaning with the long nozzle. Al2O3 particles on Si surface and 1:1 Ar/He mixture at 3000 Torr and 95 K


FIGURE 1.14 SEM images (a) before and (b) after cleaning with the long nozzle. Al2O3 particles on Si surface and 1:1 Ar/He mixture at 2000 Torr and 95 K


FIGURE 1.15 SEM images (a) before and (b) after cleaning with the long nozzle. Al2O3

particles on Si surface and pure Ar at 1500 Torr and 95 K


FIGURE 1.16 SEM images before (left) and after (right) cleaning of Cu particles on a Si surface using 1:1 Ar/He gas mixture expanded through a long nozzle at 4000 Torr

Copyright 2011 Elsevier Inc. All rights reserved. Chapter 1 Jin W. Lee.

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