HITACHICOPPER CLAD

LAMINATES

CO

PP

ER

CL

AD

LA

MIN

AT

ES

2017

In the world of electronics, especially information systems

and equipment, advancements are occurring

on a daily basis and many new technologies

are rebuting one after the other.

Hitachi Chemical Co., Ltd. is engaged

in producing materials from printed wiring boards

to substrates and in processing materials

using "combined technology," a combination of

our existing reliable technologies developed over years

and of leading-edge technologies.

The balanced, reliable, advanced solutions of Hitachi Chemical

and related peripheral technologies are designed

to support the electronics of the future.

The solution you need is here

In the world of electronics, especially information systems

and equipment, advancements are occurring

on a daily basis and many new technologies

are rebuting one after the other.

Hitachi Chemical Co., Ltd. is engaged

in producing materials from printed wiring boards

to substrates and in processing materials

using "combined technology," a combination of

our existing reliable technologies developed over years

and of leading-edge technologies.

The balanced, reliable, advanced solutions of Hitachi Chemical

and related peripheral technologies are designed

to support the electronics of the future.

The solution you need is here

CONTENTS

Recommended Base Materials by Application CharacteristicsGlass Epoxy Multilayer Materials

MCL-HS100MCL-E-770GMCL-E-705GMCL-E-700GMCL-E-679FGMCL-E-679F TypeRMCL-E-78GTD-002MCL-E-75GMCL-E-67

Materials for ICT InfrastructureMCL-E-679 TypeWMCL-LW-900G/910GMCL-HE-679G TypeS

Polyimide Multilayer MaterialMCL-I-671

Glass Epoxy Double Sided MaterialsMCL-E-67

CEM-3E-668T TypeKTracking resistanceMaterials for Fine Patterning PF-ELEpoxy Adhesive Film

AS-2600KOBELITE LAMINATE

KEL-GEF TypeRKEL-571Only non-woven aramid structureKEL-973Composite structure of non-woven aramid and polyester

Precautionary StatementPrecautions for UsePrecautions in ProcessPrecautions in DesigningPrecautions for Use of Completed PWBRecommendation Press Condition for Multilayer BoardLamination

StandardsUL StandardBS StandardCSA Standard

P4P6P9P10P12P14P16P18P20P22P24P26P28P31P32P34P36P39P40P43P44P47P48P51P52P55P56P57P60P62P62P65P66P67P68P69

P70P83P84P85

Feature

Product

Halogen Free

Game Instrument

Personal Computer

Mobile Phone

RouterServer

Base Station

Antenna

Memory Modules

ITS

UL ANSI

Page

Envi

ronm

enta

lly

Frie

ndly

C

onsu

mer

pro

duct

s In

fras

truc

ture

P

rodu

cts

Elec

tron

ics

Dev

ices

Pro

duct

sA

utom

otiv

e P

rodu

cts

Lead Free Application(288)

SemiconductorTesting Devices

High-frequencyParts

ElectronicControl Unit

AutomotiveElectronics

Package ForSemiconductor(BGACSPMCM)

Digital ConsumerProducts

Recommended Base Materials by Application

Feature

Product

Halogen Free

Game Instrument

Personal Computer

Mobile Phone

RouterServer

Base Station

Antenna

Memory Modules

ITS

UL ANSI

Page

Envi

ronm

enta

lly

Frie

ndly

C

onsu

mer

pro

duct

s In

fras

truc

ture

P

rodu

cts

Elec

tron

ics

Dev

ices

Pro

duct

sA

utom

otiv

e P

rodu

cts

Lead Free Application(288)

SemiconductorTesting Devices

High-frequencyParts

ElectronicControl Unit

AutomotiveElectronics

Package ForSemiconductor(BGACSPMCM)

Digital ConsumerProducts

10

12

14

16

FR-4.1

18

FR-4.0

32

FR-4.0

44

GPY

40

FR-4.1

36

34

FR-4.0

28

FR-4.1

26

FR-4.1

22

FR-4.0

20

24

MultiLayer MaterialsMaterials For

ICTInfrastructure

Glass Epoxy Double Side

Materials

MCL-E-67

GoodDimensional Reliability,

and Dielectric Property

Low Elastic Modulus

MCL-E-679

Type(W)

High Tg, High

insulating Reliability

MCL-E-679F Type(R)

High Tg, High

Elasticity, Low

Thermal Expansion

MCL-E-679FG

High Tg, High

Elasticity, Low

Thermal Expansion

MCL-LW-900GMCL-LW-910G

High Tg High Heat

Resistance, Low

Dielectric Constant,

LowDissipation

Factor

52

Materialsfor Fine

Patterning

PF-EL

Semi- additiveProcess

Compatible

PolyimideMultilayerMaterials

MCL-I-671

High Tg, High Heat Resistance

MCL-E-67

Dimensional Stability,

Low Warpage

CEM-3

48

CEM-3

E-668TTypeK

High CTI

CEM-3

Low Dielectric Constant,

High Elasticity

MCL-E-705G

MCL-HS100

High Tg, High

Elasticity, Low

Thermal Expansion

High Tg, Low Dielectric

Constant, Low

DissipationFactor,

Low Thermal

Expansion

MCL-E-770G

High Tg, High

Elasticity, Low

Thermal Expansion

MCL-E-700G

High Tg, High

Elasticity, Low

Thermal Expansion

High Heat Resistance,

Low Dielectric Constant

MCL-HE-679GType S

High Tg, HighHeat

Resistance

MCL-E-75G

MCL-E-78G TD-002

4

Feature

Product

Halogen Free

Game Instrument

Personal Computer

Mobile Phone

RouterServer

Base Station

Antenna

Memory Modules

ITS

UL ANSI

Page

Envi

ronm

enta

lly

Frie

ndly

C

onsu

mer

pro

duct

s In

fras

truc

ture

P

rodu

cts

Elec

tron

ics

Dev

ices

Pro

duct

sA

utom

otiv

e P

rodu

cts

Lead Free Application(288)

SemiconductorTesting Devices

High-frequencyParts

ElectronicControl Unit

AutomotiveElectronics

Package ForSemiconductor(BGACSPMCM)

Digital ConsumerProducts

Recommended Base Materials by Application

Feature

Product

Halogen Free

Game Instrument

Personal Computer

Mobile Phone

RouterServer

Base Station

Antenna

Memory Modules

ITS

UL ANSI

Page

Envi

ronm

enta

lly

Frie

ndly

C

onsu

mer

pro

duct

s In

fras

truc

ture

P

rodu

cts

Elec

tron

ics

Dev

ices

Pro

duct

sA

utom

otiv

e P

rodu

cts

Lead Free Application(288)

SemiconductorTesting Devices

High-frequencyParts

ElectronicControl Unit

AutomotiveElectronics

Package ForSemiconductor(BGACSPMCM)

Digital ConsumerProducts

10

12

14

16

FR-4.1

18

FR-4.0

32

FR-4.0

44

GPY

40

FR-4.1

36

34

FR-4.0

28

FR-4.1

26

FR-4.1

22

FR-4.0

20

24

MultiLayer MaterialsMaterials For

ICTInfrastructure

Glass Epoxy Double Side

Materials

MCL-E-67

GoodDimensional Reliability,

and Dielectric Property

Low Elastic Modulus

MCL-E-679

Type(W)

High Tg, High

insulating Reliability

MCL-E-679F Type(R)

High Tg, High

Elasticity, Low

Thermal Expansion

MCL-E-679FG

High Tg, High

Elasticity, Low

Thermal Expansion

MCL-LW-900GMCL-LW-910G

High Tg High Heat

Resistance, Low

Dielectric Constant,

LowDissipation

Factor

52

Materialsfor Fine

Patterning

PF-EL

Semi- additiveProcess

Compatible

PolyimideMultilayerMaterials

MCL-I-671

High Tg, High Heat Resistance

MCL-E-67

Dimensional Stability,

Low Warpage

CEM-3

48

CEM-3

E-668TTypeK

High CTI

CEM-3

Low Dielectric Constant,

High Elasticity

MCL-E-705G

MCL-HS100

High Tg, High

Elasticity, Low

Thermal Expansion

High Tg, Low Dielectric

Constant, Low

DissipationFactor,

Low Thermal

Expansion

MCL-E-770G

High Tg, High

Elasticity, Low

Thermal Expansion

MCL-E-700G

High Tg, High

Elasticity, Low

Thermal Expansion

High Heat Resistance,

Low Dielectric Constant

MCL-HE-679GType S

High Tg, HighHeat

Resistance

MCL-E-75G

MCL-E-78G TD-002

5

Item Condition Unit

UL ANSI

ppm/

sec.

kN/m

m

GPa

cm

W/mK

Tg

CTE1

Solder Heat

Water Absorption

TMA

30120

Tg

Tg

A

A

A

A

C-96/20/65

C-96/20/65

C-96/20/65

C-96/20/65

E-24/50

A

Xe-flash

Z

18m

35m

1MHz

1GHz2

1MHz

1GHz2

Copper Peel Strength

Dielectric Constant

Dissipation Factor

Volume Resistivit