Automotive-grade N-channel 300 V, 53 A, 0.037 typ., MDmesh ... · Peak diode recovery voltage slope...

17
This is information on a product in full production. April 2014 DocID026126 Rev 2 1/17 STB46N30M5 Automotive-grade N-channel 300 V, 53 A, 0.037 Ω typ., MDmesh™ V Power MOSFET in a D 2 PAK package Datasheet - production data Figure 1. Internal schematic diagram Features Designed for automotive applications and AEC-Q101 qualified Amongst the best R DS(on) * area High dv/dt capability Excellent switching performance Easy to drive 100% avalanche tested Applications Switching applications Description This device is an N-channel MDmesh™ V Power MOSFET based on an innovative proprietary vertical process technology, which is combined with STMicroelectronics’ well-known PowerMESH™ horizontal layout structure. The resulting product has extremely low on- resistance, which is unmatched among silicon- based Power MOSFETs, making it especially suitable for applications which require superior power density and outstanding efficiency. D PAK 2 1 3 TAB Order code V DS R DS(on) max. I D STB46N30M5 300 V 0.04 Ω 53 A Table 1. Device summary Order code Marking Packages Packaging STB46N30M5 46N30M5 D 2 PAK Tape and reel www.st.com

Transcript of Automotive-grade N-channel 300 V, 53 A, 0.037 typ., MDmesh ... · Peak diode recovery voltage slope...

Page 1: Automotive-grade N-channel 300 V, 53 A, 0.037 typ., MDmesh ... · Peak diode recovery voltage slope 15 V/ns Tstg Storage temperature - 55 to 150 °C Tj Max. operating junction temperature

This is information on a product in full production.

April 2014 DocID026126 Rev 2 1/17

STB46N30M5

Automotive-grade N-channel 300 V, 53 A, 0.037 Ω typ., MDmesh™ V Power MOSFET in a D2PAK package

Datasheet - production data

Figure 1. Internal schematic diagram

Features

• Designed for automotive applications and AEC-Q101 qualified

• Amongst the best RDS(on) * area

• High dv/dt capability

• Excellent switching performance

• Easy to drive

• 100% avalanche tested

Applications• Switching applications

DescriptionThis device is an N-channel MDmesh™ V Power MOSFET based on an innovative proprietary vertical process technology, which is combined with STMicroelectronics’ well-known PowerMESH™ horizontal layout structure. The resulting product has extremely low on-resistance, which is unmatched among silicon-based Power MOSFETs, making it especially suitable for applications which require superior power density and outstanding efficiency.

D PAK2

13

TAB

Order code VDS RDS(on) max. ID

STB46N30M5 300 V 0.04 Ω 53 A

Table 1. Device summary

Order code Marking Packages Packaging

STB46N30M5 46N30M5 D2PAK Tape and reel

www.st.com

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Contents STB46N30M5

2/17 DocID026126 Rev 2

Contents

1 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3

2 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

2.1 Electrical characteristics (curves) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6

3 Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9

4 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

5 Packaging mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

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DocID026126 Rev 2 3/17

STB46N30M5 Electrical ratings

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1 Electrical ratings

Table 2. Absolute maximum ratings

Symbol Parameter Value Unit

VGS Gate-source voltage ± 25 V

ID Drain current (continuous) at TC = 25 °C 53 A

ID Drain current (continuous) at TC = 100 °C 34 A

IDM (1)

1. Pulse width limited by safe operating area

Drain current (pulsed) 212 A

PTOT Total dissipation at TC = 25 °C 250 W

dv/dt (2)

2. ISD ≤ 53 A, di/dt ≤ 400 A/µs, VDS(peak) < V(BR)DSS, VDD=240 V

Peak diode recovery voltage slope 15 V/ns

Tstg Storage temperature - 55 to 150 °C

Tj Max. operating junction temperature 150 °C

Table 3. Thermal data

Symbol Parameter Value Unit

Rthj-case Thermal resistance junction-case max 0.5 °C/W

Rthj-pcb(1)

1. When mounted on 1 inch² FR-4, 2 Oz copper board

Thermal resistance junction-pcb max 30 °C/W

Table 4. Thermal data

Symbol Parameter Value Unit

IARAvalanche current, repetitive or not-repetitive (pulse width limited by Tj max)

16 A

EASSingle pulse avalanche energy

(starting Tj = 25°C, ID = IAR, VDD = 50 V)550 mJ

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Electrical characteristics STB46N30M5

4/17 DocID026126 Rev 2

2 Electrical characteristics

(TC = 25 °C unless otherwise specified).

Table 5. On /off states

Symbol Parameter Test conditions Min. Typ. Max. Unit

V(BR)DSS

Drain-source breakdown voltage (VGS = 0)

ID = 1 mA 300 V

IDSSZero gate voltage

drain current (VGS = 0)

VDS = 300 V 1 µA

VDS = 300 V, TC=125 °C 100 µA

IGSSGate-body leakagecurrent (VDS = 0)

VGS = ± 25 V ±100 nA

VGS(th) Gate threshold voltage VDS = VGS, ID = 250 µA 3 4 5 V

RDS(on)Static drain-sourceon-resistance

VGS = 10 V, ID = 26.5 A 0.037 0.04 Ω

Table 6. Dynamic

Symbol Parameter Test conditions Min. Typ. Max. Unit

Ciss Input capacitance

VDS = 100 V, f = 1 MHz, VGS = 0

- 4240 - pF

Coss Output capacitance - 205 - pF

CrssReverse transfer capacitance

- 9.5 - pF

Co(tr) (1)

1. Co(tr) is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDS.

Equivalent capacitance time related

VDS = 0 to 240 V, VGS = 0

- 373 - pF

Co(er) (2)

2. Co(er) is defined as a constant equivalent capacitance giving the same charging time as Coss when VDS increases from 0 to 80% VDS.

Equivalent capacitance energy related

- 202 - pF

Rg Gate input resistance

f = 1 MHz, gate DC Bias = 0,test signal level = 20 mV,ID = 0

- 1.4 - Ω

Qg Total gate charge VDD = 240 V, ID = 24 A,

VGS = 10 V(see Figure 16)

- 95 - nC

Qgs Gate-source charge - 23 - nC

Qgd Gate-drain charge - 37 - nC

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DocID026126 Rev 2 5/17

STB46N30M5 Electrical characteristics

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Table 7. Switching times

Symbol Parameter Test conditions Min. Typ. Max Unit

td(v) Voltage delay timeVDD = 240 V, ID = 32 A,

RG = 4.7 Ω, VGS = 10 V(see Figure 15)

- 66 - ns

tr(v) Voltage rise time - 15 - ns

tf(i) Current fall time - 24 - ns

tc(off) Crossing time - 22.5 - ns

Table 8. Source drain diode

Symbol Parameter Test conditions Min. Typ. Max. Unit

ISD Source-drain current - 53 A

ISDM (1)

1. Pulse width limited by safe operating area

Source-drain current (pulsed) - 212 A

VSD (2)

2. Pulsed: pulse duration = 300 µs, duty cycle 1.5%

Forward on voltage ISD = 53 A, VGS = 0 - 1.5 V

trr Reverse recovery timeISD = 48 A, di/dt = 100 A/µsVDD = 60 V (see Figure 20)

- 223 ns

Qrr Reverse recovery charge - 2.5 μC

IRRM Reverse recovery current - 23 A

trr Reverse recovery time ISD = 48 A, di/dt = 100 A/µsVDD = 60 V, Tj = 150 °C(see Figure 20)

- 280 ns

Qrr Reverse recovery charge - 3.9 μC

IRRM Reverse recovery current - 28 A

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Electrical characteristics STB46N30M5

6/17 DocID026126 Rev 2

2.1 Electrical characteristics (curves) Figure 2. Safe operating area Figure 3. Thermal impedance

Figure 4. Output characteristics Figure 5. Transfer characteristics

Figure 6. Gate charge vs gate-source voltage Figure 7. Static drain-source on-resistance

ID

100

10

1

0.1 1 VDS(V)10

(A)

Operat

ion in

this

area i

s

Limite

d by m

ax R

DS(on)

10µs

1ms100µs

0.1

Tj=150°CTc=25°CSingle pulse

10ms

100

AM18133v1

ID

00 5 VDS(V)10

(A)

15

80

6V

7V

VGS=10V

20

40

60

100

20

8V9V

120

140

AM18134v1ID

60

40

20

03 5 VGS(V)7

(A)

4 6 8

80

VDS=25V

9

100

120

140

AM18135v1

VGS

6

4

2

00 40 Qg(nC)

(V)

8

60 80

10

VDD=240VID=24A12

150

100

50

0

200

250VDS

20 100

VDS(V)

AM18136v1 RDS(on)

0.034

0.032

0.030 20 ID(A)

(Ω)

10 30

0.036

VGS=10V

40 50

0.038

0.04

AM18137v1

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DocID026126 Rev 2 7/17

STB46N30M5 Electrical characteristics

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Figure 8. Capacitance variations Figure 9. Output capacitance stored energy

Figure 10. Normalized gate threshold voltage vs temperature

Figure 11. Normalized on-resistance vs temperature

Figure 12. Normalized V(BR)DSS vs temperature Figure 13. Source-drain diode forward characteristics

C

1000

100

10

10.1 10 VDS(V)

(pF)

1 100

Ciss

Coss

Crss

10000

AM18138v1 Eoss

4

2

00 50 VDS(V)

(µJ)

200100 150

6

250 300

8

10

AM18139v1

V(BR)DSS

-50 0 TJ(°C)

(norm)

-25 7525 50 1000.92

0.94

0.96

0.98

1.00

1.04

1.06

1.02

ID = 1mA1.08

AM10399v1

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Electrical characteristics STB46N30M5

8/17 DocID026126 Rev 2

Figure 14. Switching losses vs gate resistance (1)

1. Eon including reverse recovery of a SiC diode

E

00 20 RG(Ω)

(µJ)

10 30

200

400

40

ID=32A

VDD=240V Eon

Eoff

600

VGS=10V

800

1000

AM18140v1

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DocID026126 Rev 2 9/17

STB46N30M5 Test circuits

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3 Test circuits

Figure 15. Switching times test circuit for resistive load

Figure 16. Gate charge test circuit

Figure 17. Test circuit for inductive load switching and diode recovery times

Figure 18. Unclamped inductive load test circuit

Figure 19. Unclamped inductive waveform Figure 20. Switching time waveform

AM01468v1

VGS

PW

VD

RG

RL

D.U.T.

2200

μF3.3μF

VDD

AM01469v1

VDD

47kΩ 1kΩ

47kΩ

2.7kΩ

1kΩ

12V

Vi=20V=VGMAX

2200μF

PW

IG=CONST100Ω

100nF

D.U.T.

VG

AM01470v1

AD

D.U.T.

SB

G

25 Ω

A A

BB

RG

G

FASTDIODE

D

S

L=100μH

μF3.3 1000

μF VDD

AM01471v1

Vi

Pw

VD

ID

D.U.T.

L

2200μF

3.3μF VDD

AM01472v1

V(BR)DSS

VDDVDD

VD

IDM

ID

AM05540v1

Id

Vgs

Vds

90%Vds

10%Id

90%Vgs on

Tdelay-off

TfallTrise

Tcross -over

10%Vds

90%Id

Vgs(I(t))

on

-off

TfallTrise

-

))

Concept waveform for Inductive Load Turn-off

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Package mechanical data STB46N30M5

10/17 DocID026126 Rev 2

4 Package mechanical data

In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark.

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DocID026126 Rev 2 11/17

STB46N30M5 Package mechanical data

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Figure 21. D²PAK (TO-263) drawing

0079457_T

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Package mechanical data STB46N30M5

12/17 DocID026126 Rev 2

Table 9. D²PAK (TO-263) mechanical data

Dim.mm

Min. Typ. Max.

A 4.40 4.60

A1 0.03 0.23

b 0.70 0.93

b2 1.14 1.70

c 0.45 0.60

c2 1.23 1.36

D 8.95 9.35

D1 7.50

E 10 10.40

E1 8.50

e 2.54

e1 4.88 5.28

H 15 15.85

J1 2.49 2.69

L 2.29 2.79

L1 1.27 1.40

L2 1.30 1.75

R 0.4

V2 0° 8°

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DocID026126 Rev 2 13/17

STB46N30M5 Package mechanical data

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Figure 22. D²PAK footprint(a)

a. All dimension are in millimeters

16.90

12.20

9.75

3.50

5.08

1.60

Footprint

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Packaging mechanical data STB46N30M5

14/17 DocID026126 Rev 2

5 Packaging mechanical data

Figure 23. Tape

P1A0 D1

P0

F

W

E

D

B0K0

T

User direction of feed

P2

10 pitches cumulativetolerance on tape +/- 0.2 mm

User direction of feed

R

Bending radius

B1

For machine ref. onlyincluding draft andradii concentric around B0

AM08852v1

Top covertape

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DocID026126 Rev 2 15/17

STB46N30M5 Packaging mechanical data

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Figure 24. Reel

Table 10. D²PAK (TO-263) tape and reel mechanical data

Tape Reel

Dim.mm

Dim.mm

Min. Max. Min. Max.

A0 10.5 10.7 A 330

B0 15.7 15.9 B 1.5

D 1.5 1.6 C 12.8 13.2

D1 1.59 1.61 D 20.2

E 1.65 1.85 G 24.4 26.4

F 11.4 11.6 N 100

K0 4.8 5.0 T 30.4

P0 3.9 4.1

P1 11.9 12.1 Base qty 1000

P2 1.9 2.1 Bulk qty 1000

R 50

T 0.25 0.35

W 23.7 24.3

A

D

B

Full radius G measured at hub

C

N

REEL DIMENSIONS

40mm min.

Access hole

At slot location

T

Tape slot in core fortape start 25 mm min.width

AM08851v2

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Revision history STB46N30M5

16/17 DocID026126 Rev 2

6 Revision history

Table 11. Document revision history

Date Revision Changes

24-Mar-2014 1 Initial release.

11-Apr-2014 2– Document status promoted from preliminary data to production

data

– Minor text changes

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DocID026126 Rev 2 17/17

STB46N30M5

17

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