Angstrem 16 07_2010l

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Angstrem Angstrem P P JSC JSC i i ntroduction ntroduction

Transcript of Angstrem 16 07_2010l

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Angstrem Angstrem PPJSC JSC iintroductionntroduction

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Angstrem PJSC

25.06.1963Establishmentof R&D Institute of Precision Technologywith “Angstrem” experimental fab

23.06.1993Restructuring into Angstrem JSC

Specialization

• Standard, custom and semi-custom LSI design.• 150 mm IC wafer processing (0.6 – 1.0 μm) – 8 000 wafers/month.• Assembly into ceramic-metal and plastic packages.• Assembly of modules, smart cards, RF transponders and card readers.• Product testing and certification.• ISO-9001 (1994/2000) certified in 2000.

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Angstrem PJSC Activities• Design, production and sales of

state-of-the-art products:electronic ICs, semiconductor and MEMS devices.

• Enhancement and upgrading ofdesign and production technologies.

• Customer satisfaction throughall currently used device production modes, including:

“Front-End”, “Back-End”, “Fabless”, “Foundry”, etc.

• Offering our customers modern circuit design environment to provide integrated solutions for the customer’s

“know-how”.

• Engaging foreign foundry companiesfor product manufacturing.

• Testing and qualification of products for a variety of applications.

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Products

Angstrem is the Russian leader in the following products: – Mass production:

• Gate-array chips configurable into semi-custom LSI circuits,• Identification LSI (contact ID and RFID),• Memory LSI, • Power devices,• LCD control LSI.

Baseline upgradeable products:• Microprocessors, microcontrollers, DSPs,• Analog-Digital IC,• Standard logic IC,• Identification (ID) devices and systems,• Interface LSI,• Radio, TV, telecommunications LSI,• Automotive LSI,• Power-saving system LSI, • Medical application LSI,• Electronic calculator, clock/watch. Game LSI.

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Sales Markets

Ind ia

Singapore

TaiwanHong Kong

ChinaKorea

JapanCyprus

UkraineBulgaria

Austria

USA

LithuaniaByelorussia

Russia

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MCU

MCU+EEPROM

МPU + МPU RISC (32 b.)

DSP

SRAM, ROM

LCD Drivers

Logic, Gate Arrays

Mixed signal

AD Arrays

High Voltage

Power MOSFET

Foundry

1P1M,

1P2M

1P1M,

1P2M

1P1M, 1P2M, 2P1M1P1M, 1P2M,

2Р2М

1.2-2.0 m1.6-2.0 m1.0-1.2 m0.6-0.8 m

MOSFET,

FRED,

IGBT

BiCMOSCMOS

Basic Technologies

Under dev.

Under dev.

CMOS with 2.0, 1.6, 1.2, 1.0, 0.8, 0.6 µm design rules

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150 mm Production Line (Fab 1)Capacity – 8 000 wafers/month, design rules – 0.6-1.0 μm

Area Equipment

PhotolithographyCanon FPA2000i steppers

(0.45 μm)

Dry etchingLAM (RAINBOW 4620; 4500;

TCP9400); Matrix106; GIR-260

Ion Implantation Eaton NV-10-90; NV-6200

Wet Bench FSI; Semitool (SRD); Verteq

CVD ASM

Diffusion ASM

Metallization MRC

TestingMPV-CD; MPV-SP; CD-SEM;

Imager 3300; RS50e; Vector-22

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2010-2012

Technology prospects

Transition to 0.35-0.5 μm CMOS technology Increasing production capacity Extending traditional production lines by adding new ICtypes like new LSI, VLSI, MRS, RFID, multiplexers, etc.

Strong points

Company advantages

Many years experience in microelectronics (over 45 years) Wide range of electronic devices (LSI,VLSI, memory, microprocessors, ASIC, other logic circuits) Own school of process engineers and designers The first Russian company to develop design environments (design rules, cell libraries, processing files)

Future Prospects and Advantages(Angstrem PJSC plant)

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Quality Certificates

EN ISO 9001 (2000)15.03.2006 г.

EN ISO 9001 (1994)27.09.2000